Concrete PCD Gringing Segment, for Grinding The Epoxy Resin

• Customization: Available
• Binding Agent: Metal Bond
• Production Technology: High-Frequency Welding
• Model NO.: SZJ93A
• Transport Package: White Box
• Specification: SGS
• Trademark: DAVAM
• Origin: China
• HS Code: 8202310000
• Production Capacity: 50000PCS/Year
• Package Size: 11.00cm * 33.00cm * 15.00cm
• Package Gross Weight: 15.000kg

Product Description

Diamond cutting wheel (also called diamond grinding wheel or cutting disc) is an efficient tool that uses diamond particles as abrasives and is designed for cutting and grinding superhard materials. The following is a comprehensive analysis of it:

1. Structure and principle
Composition:

Diamond abrasive grains: artificially synthesized single crystal/polycrystalline diamond, extremely high hardness (Mohs 10), responsible for cutting.

Binder: metal (such as cobalt, nickel), resin, ceramic or electroplating layer, fixes the abrasive grains and transmits cutting force.

Matrix: usually a steel disc or mesh structure, providing support.

Working principle: When rotating at high speed, the exposed part of the diamond particles micro-cuts the material, and the binder gradually wears away to expose new abrasive grains and keep them sharp.

2. Core advantages
High efficiency and durability: The life span is dozens of times that of ordinary grinding wheels, suitable for mass processing.

High precision: the cut is smooth and reduces material loss (such as precision ceramics and semiconductor cutting).

Versatility: It can process materials that are difficult to process with traditional tools, such as glass, tungsten carbide, gemstones, concrete, etc.

Low thermal damage: Under reasonable use, the heat dissipation is fast, reducing the thermal deformation of the workpiece.

III. Main types
Classification by binder:

Metal binder: Strong wear resistance, suitable for hard and brittle materials (stone, concrete).

Resin binder: Good elasticity, used for precision polishing (optical glass, ceramics).

Electroplating type: Single layer diamond, suitable for small batch or special-shaped processing.

Classification by shape:

Parallel grinding wheel, cup grinding wheel, disc cutting disc, ultra-thin saw blade (0.1mm thickness for wafer cutting).

IV. Selection guide
Material matching:

Granite/marble: Select metal binder + coarse grain (20/30 mesh).

Carbide: Fine grain resin grinding wheel (above 100 mesh) + coolant.

Glass/silicon wafer: High concentration electroplated diamond ultra-thin sheet

Parameter considerations:

Grit size: coarse grain (fast slotting) vs fine grain (smooth surface).

Concentration: diamond ratio (usually 75%-100%), high concentration prolongs life but costs more.

Speed matching: It is strictly forbidden to exceed the maximum speed of the grinding wheel to prevent explosion.

V. Use and maintenance
Safe operation:

Wear goggles, dust masks, and install protective covers on the equipment.

Start the machine and run it idle for 1 minute to confirm that there is no abnormal vibration.

Cutting skills:

Maintain vertical feed to avoid lateral force causing edge collapse.

Use water or special coolant to cool down in time (resin grinding wheels should avoid water and need dry cutting).

Maintenance points:

Regularly use cleaning stones or alumina blocks to "sharpen the blade" to remove blocked debris.

Store moisture-proof and collision-proof, and resin grinding wheels should be protected from light to prevent aging.

VI. Common problems and solutions
Excessive wear: It may be caused by too hard a bond or too soft a material → Replace a soft bond grinding wheel.

Cutting speed decreases: blockage or abrasive passivation → clean or trim the grinding wheel surface.

Cut edge collapse: too coarse grain or too fast feed → change to fine grain/reduce feed speed.

VII. Application scenarios
Construction industry: concrete wall sawing, stone carving.

Manufacturing industry: carbide tool sharpening, ceramic component finishing.

Electronic industry: silicon wafer, sapphire substrate cutting.

Jewelry processing: precise cutting of diamonds and jade.

Through reasonable selection and standardized operation, diamond cutting wheels can significantly improve processing efficiency and quality, becoming the core tool for hard material processing.

PCD grinding segment, Concrete PCD Gringing segment, diamond grinding discs, grinding discs

1. For grinding the epoxy resin
2. With PCD and diamond

40x10x10mm, The Double Rectangular Segments grinding plates remove adhesives, coatings and lippage, taking the floor from coarsely structured surface to prepolishing.

Available in Standard and Premium quality

Levels and aggressively removes stock

Longlasting and resistant to high temperatures

Available in soft, medium and hard bond for all different Grit With one segment