Diamond Grinding Wheels, Diamond Grinding Pad

Product Details
Customization: Available
Production Technology: Welding Process
Binding Agent: Metal Bond
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  • Diamond Grinding Wheels, Diamond Grinding Pad
  • Diamond Grinding Wheels, Diamond Grinding Pad
  • Diamond Grinding Wheels, Diamond Grinding Pad
  • Diamond Grinding Wheels, Diamond Grinding Pad
  • Diamond Grinding Wheels, Diamond Grinding Pad
  • Diamond Grinding Wheels, Diamond Grinding Pad
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Basic Info.

Model NO.
SZJ93D
Transport Package
White Box
Specification
SGS
Trademark
DAVAM
Origin
China
HS Code
82023990
Production Capacity
50000PCS/Year

Packaging & Delivery

Package Size
33.00cm * 33.00cm * 15.00cm
Package Gross Weight
15.000kg

Product Description

Diamond cutting wheel (also called diamond grinding wheel or cutting disc) is an efficient tool that uses diamond particles as abrasives and is designed for cutting and grinding superhard materials. The following is a comprehensive analysis of it:

1. Structure and principle
Composition:

Diamond abrasive grains: artificially synthesized single crystal/polycrystalline diamond, extremely high hardness (Mohs 10), responsible for cutting.

Binder: metal (such as cobalt, nickel), resin, ceramic or electroplating layer, fixes the abrasive grains and transmits cutting force.

Matrix: usually a steel disc or mesh structure, providing support.

Working principle: When rotating at high speed, the exposed part of the diamond particles micro-cuts the material, and the binder gradually wears away to expose new abrasive grains and keep them sharp.

2. Core advantages
High efficiency and durability: The life span is dozens of times that of ordinary grinding wheels, suitable for mass processing.

High precision: the cut is smooth and reduces material loss (such as precision ceramics and semiconductor cutting).

Versatility: It can process materials that are difficult to process with traditional tools, such as glass, tungsten carbide, gemstones, concrete, etc.

Low thermal damage: Under reasonable use, the heat dissipation is fast, reducing the thermal deformation of the workpiece.

III. Main types
Classification by binder:

Metal binder: Strong wear resistance, suitable for hard and brittle materials (stone, concrete).

Resin binder: Good elasticity, used for precision polishing (optical glass, ceramics).

Electroplating type: Single layer diamond, suitable for small batch or special-shaped processing.

Classification by shape:

Parallel grinding wheel, cup grinding wheel, disc cutting disc, ultra-thin saw blade (0.1mm thickness for wafer cutting).

IV. Selection guide
Material matching:

Granite/marble: Select metal binder + coarse grain (20/30 mesh).

Carbide: Fine grain resin grinding wheel (above 100 mesh) + coolant.

Glass/silicon wafer: High concentration electroplated diamond ultra-thin sheet

Parameter considerations:

Grit size: coarse grain (fast slotting) vs fine grain (smooth surface).

Concentration: diamond ratio (usually 75%-100%), high concentration prolongs life but costs more.

Speed matching: It is strictly forbidden to exceed the maximum speed of the grinding wheel to prevent explosion.

V. Use and maintenance
Safe operation:

Wear goggles, dust masks, and install protective covers on the equipment.

Start the machine and run it idle for 1 minute to confirm that there is no abnormal vibration.

Cutting skills:

Maintain vertical feed to avoid lateral force causing edge collapse.

Use water or special coolant to cool down in time (resin grinding wheels should avoid water and need dry cutting).

Maintenance points:

Regularly use cleaning stones or alumina blocks to "sharpen the blade" to remove blocked debris.

Store moisture-proof and collision-proof, and resin grinding wheels should be protected from light to prevent aging.

VI. Common problems and solutions
Excessive wear: It may be caused by too hard a bond or too soft a material → Replace a soft bond grinding wheel.

Cutting speed decreases: blockage or abrasive passivation → clean or trim the grinding wheel surface.

Cut edge collapse: too coarse grain or too fast feed → change to fine grain/reduce feed speed.

VII. Application scenarios
Construction industry: concrete wall sawing, stone carving.

Manufacturing industry: carbide tool sharpening, ceramic component finishing.

Electronic industry: silicon wafer, sapphire substrate cutting.

Jewelry processing: precise cutting of diamonds and jade.

Through reasonable selection and standardized operation, diamond cutting wheels can significantly improve processing efficiency and quality, becoming the core tool for hard material processing.


Diamond grinding segment, diamond grinding wheels, Diamond Grinding pad, diamond grinding disc

1. Abrasive size: 350mm-3500mm
2. Application: For cutting granite & marble
3. With two PCD and one segmet

1. Fast cutting
2. High efficency
3. Fast cutting granite & marble
4. Segments shape: Straight, rapered or sandwich
5. Available size: 350mm-3500mm


Diamond segment, from 300mm to 3500mm, is appliable for cutting normal, soft hard Marble and Granite, Andesite, sandstone, limestone and etc and good quality for gangsaw.

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